Do different generations of DDR chips look different?
Categoria : Specification / Capacity / Performance
Most DDR modules adopt TSOP package with pins sticking out from Flash sides. Some DDR chips go with a less common FBGA package which is physically smaller, and uses a grid of tiny solder balls on bottom to make electrical contact with the board. At present, the FBGA package is the standard for all DDR2, DDR3 and DDR4 chips.
La rispost aè di aiuto?
Supporto Tecnico
Se la risposta non è d’aiuto, potete contattare il supporto tecnico
Inizia